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Equipment & Reservations

Equipment Category Location Reservations
ICP DRIE - STS Pegasus

STS Pegasus. For Silicon etching. No metals allowed.

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5 Axis Stage E-Jet

Precision 5-axis (XYZ + tip/tilt) stage with 2 additional manual z-stages, traditionally used for e-jet.

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Bonder - EVG 501 Wafer Bonding System

Electronic Visions (EVG) Wafer Bonding System 501, capable of heating to 500°C and applying force of up to 3.5kN (Max force depends on sample and bondtool material and geometry).

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Carrier Wafer Mounting Chuck

System Used to Mount Carrier Wafers for the Through Etching on the STS

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Cleaving tool by LatticeGear

Scribing tool offers a quick method for cleanly downsizing large samples. 

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Dicing Saw

 K&S 708 Dicing Saw; 4" Spindle, User must supply own blades

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Electroplating Station

Midas Six-Station Plating System, 1-Liter. Temp up to 100C. The first station is designed for electrocleaner, the second for acid dip, the third for plating. Remaining three stations are for rinse. First step in training is to determine if electroplating process allowed in this too

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Evaporator - Thermionics 4-Pocket E-beam Evaporator

Thermionics 4-pocket E-beam Evaporator. QCM for deposition thickness monitoring.

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Flood Exposure - ABM Model 60
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Fume Hood - Acid - Hydrofluoric Acid Use

Required for monitoring HF waste generation

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Fume Hood - Hot Plate Bench

Talboys Hotplate

lithography Prep Room (202A MEB) Reserve Now
Fume Hood - Laminar Flow Spinner Bench
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Fume Hood - Prep Room

Fume Hood in Prep Room for Hazardous Materials

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Glovebox

Laurell WS-400 in Glovebox

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Goniometer - KSV CAM200

KSV Instruments Model: CAM 200

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High Temperature Furnace

Thermal Technology, Model 1000-4560-FP20. Capable of temperatures up to 1750°C (up to 2250°C with system modification). Max sample size is 1cmx1cm.

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ICP DRIE - Plasmatherm

Plasmatherm SLR 770, BOSCH Process

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KOH Etching Station

Glassware required to KOH etch pieces or wafers

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Lapping System

 Lapmaster, 12" Platen

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Mask Aligner - EV620

Electronic Visions (EVG) Double-Sided Aligner 620. Mask size 4x4" or 5x5". Substrate size 4", 3", 2" diameter or 1" pieces

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Mask Aligner - EVG 420

Electronic Visions (EVG) Double-Sided Aligner 420, Wavelength 405nm. Mask size 5x5" and substrate 4" diameter

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Mask Aligner - Karl Suss MJB3

MJB3 Suss Aligner. Mask size 4x4", 3x3", or 2x2". Substrate size 3" or 2" diameter or pieces

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Microscope - Leica DMIRE

The Leica DMIRE inverted microscope has top and bottom illumination along with a UV light source and a motorized stage. There are 3 light cubes for fluorescence work including DAPI (Ex 360nm/Em 470nm), FITC (Ex 480nm/Em 527nm), and Rhodamine (Ex 546nm/Em 600nm) as well as a brightfield cube. The spectral outputs of the cubes are on a data sheet near the microscope. There are 5 objectives including 2.5X, 5X, 10X, 20X, and 50X. The microscope does have a camera and software for image generation

analysis Microscopy Suite (212 MEB) Reserve Now
Microscope - Near IR Imaging

Near infrared (1000nm-1300nm) imaging microscope with 4 objectives of 2.5x, 5x, 20x, and 50x magnification with eyepieces of 15x.

analysis MNMS Cleanroom (213 MEB) Reserve Now
Microscope - Olympus Optical Wafer Inspection

The Olympus microscope has eyepieces of 10x magnification with a reticle and 4 objectives of 5x, 10x, 20x, 50x, and 100x magnification.  Capable of Nomarski (DIC) microscopy, brightfield and darkfield

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Molecular Vapor Deposition (MVD) System

 Applied MicroStructures, Model 100, Molecular Vapor Deposition

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Oven - Curing Oven

Yamato, Mechanical Convection Oven.

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Oven - Vacuum Annealer

The vacuum annealing system has a maximum operating temperature of 400°C and uses nitrogen as a purge gas to reduce contamination.

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Oven - Vacuum Oven
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Probe Station

 Signatone S-1170

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Profilometer - KLA-TENCOR Alpha D500

Alpha Step D-500 - 2µm tip

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RIE - Axic

Reactive Ion Etcher, O2, Ar, CF4, 500W RF, Computer Controlled

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RIE - March Jupiter III

Reactive Ion Etcher, O2, Ar, ArH2, 300W RF, Manually Controlled

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SEM - Hitachi S-2250N

Tungsten filament SEM with both high vacuum (4.5nm resolution) and low vacuum (10nm resolution) modes. Low vauum (N SEM or Environmental SEM) mode capable of 0.01 - 2 Torr pressure control for biological and non-conductive sample microscopy. Detectors include SE, Robinson BSE, Solid State BSE, and Oxford INCA EDS

analysis Microscopy Suite (212 MEB) Reserve Now
SEM - Hitachi S570

Hitachi S570 Scanning Electorn Microscope. 20X-100kX magnification w standard specimen stage .12X-100kX with large-sized specimin stage. 0.5-30kV accelerating voltage. 150mm maximum specimen diameter. 6mm, 15mm, or 50mm diameter stub size

analysis Microscopy Suite (212 MEB) Reserve Now
SEM - Oxford INCA EDS Detector on Hitachi S-2250N

Oxford INCA EDS Detector for Hitachi S-2250N SEM

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Sonic Mill

Used for drilling single or multiple holes/shapes into brittle materials (i.e. Si, SiO2, Al2O3, etc.)

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Spinner (Left)

 BidTec SP-100, 0-7500 rpm, 15" Bowl

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Spinner (Right)

BidTec SP-100, 0-7500 rpm, 15" Bowl

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Spinner - High Speed

CEE-100, 0-10,000 rpms

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Sputterer - AJA 8-Gun DC Metal Sputtering System

 8 Gun Metal Targets - See system for material list

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Sputterer - Confocal 3-Gun RF and Pulsed-DC Dielectric

3 Gun Dielectric Targets - See system for material list

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Supercritical Point Dryer

Tousimis Automegasamdry -915B: 6" and smaller sample size

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Transfer Printer - Large

Precision 4-axis (XYZ + rotation) stage, accepts 1"x3" glass slides held by vacuum chuck.

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Transfer Printer - Laser

Precision 3-axis (XYZ), with 30W 805nm CW diode laser with a dichoric filter.

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Tube Furnace - Anneal Tube

Max Temp 1200°C. Used for annealing silicon. No metals or other materials allowed.

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Tube Furnace - Boron Tube

 Max Temp 1200°C. Used for boron doping Silicon. No metals or other materials allowed.

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Tube Furnace - Dirty Tube

Max Temp 1200°C. General use tube.

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Tube Furnace - Oxidation Tube

Max Temp 1200°C. Used for growing thermal oxide films on Silicon. No metals or other materials allowed.

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Tube Furnace - Phosphorus Tube

 Max Temp 1200°C. Used for phosphorus doping Silicon. No metals or other materials allowed.

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Ultrasonic Cleaner
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Vibrometer

Polytec laser vibrometer is used to measure displacement or velocity of vibrations. The Polytec OFV-3001, frequency range: DC to 20MHz, velocity rang: 0.3um/s to 10m/s.

analysis Microscope Suite (212 MEB) Reserve Now