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Cleaving tool by LatticeGear

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  • Enables accurate cleaving through frontside targets with a scribe made on the backside of the substrate
  • Scribe does not damage the frontside of the sample
  • Accuracy of scribe ±200 μm (achievable)
  • Flexible with respect to sample size and shape
  • Capable of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving
  • The length of the scribe can be varied from 1 mm to 100 mm

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