Cleaving tool by LatticeGear
- Enables accurate cleaving through frontside targets with a scribe made on the backside of the substrate
- Scribe does not damage the frontside of the sample
- Accuracy of scribe ±200 μm (achievable)
- Flexible with respect to sample size and shape
- Capable of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving
- The length of the scribe can be varied from 1 mm to 100 mm